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ENGINEERING CASE / SPEC → HARDWARE

EchoMind: one specification, connected engineering.

Follow the native designs and measured bench work across electronics, mechanical integration, FPGA and host software.

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FEATURED PROJECT

From sensing brief to PCB, enclosure and FPGA.

EchoMind

EchoMind shows how the USSAIR10000 sensing brief becomes a native PCB, a compact enclosure, FPGA transport RTL and host software. Cross9 is a nine-sensor design assembly; the separate three-sensor FPGA bench has physical capture evidence.

USSAIR10000 sensingNine-sensor Cross9 CADThree-sensor FPGA bench
Explore the design flow
Source-derived Cross9 R3 closed enclosure CAD with nine acoustic openings; physical fit and fabrication remain unverified.
Cross9 R3 · source-derived closed enclosure CAD; physical fit remains to be checked

Inside EchoMind

Click an image to see the full-size design.

Native top-side 3D export of the EchoMind Cross9 R3 carrier PCB, showing nine sensor connectors, mounted components and the 64 by 43 millimeter outline.
Cross9 PCB topR3 native 3D PCB export · nine sensor connectors
Native underside 3D export of the EchoMind Cross9 R3 carrier PCB, including the two FPGA module connectors.
Cross9 PCB undersideR3 native 3D PCB export · FPGA module connectors
Source-derived Cross9 R3 closed enclosure CAD with nine acoustic openings; physical fit and fabrication remain unverified.
Closed enclosure CADR3 source-derived CAD · physical fit unverified
USSAIR10000 engineering flow from sensor inputs through four-bus FPGA RTL, signed I/Q capture and host display; three physical nodes measured at 400 kilohertz, while localization accuracy remains unverified.
FPGA and RTL pathUSSAIR10000 · three-sensor bench and research observer

Engineering evidence · 18 October 2026

Explore the current engineering outputs

Cross9 PCB

A 64 × 43 mm native carrier design with nine sensor interfaces and a direct FPGA module connection.

View native PCB render

Mechanical integration

A source-derived closed enclosure CAD aligns nine acoustic openings with the carrier design.

View closed enclosure

FPGA and RTL

Four independent RTL buses, timestamped transport and a three-sensor physical bench at 400 kHz. A passive INT/PROG observer was added to investigate timing.

View engineering flow

Cross9 R3 is a reviewed CAD and PCB design assembly; physical first fit and full nine-node function remain to be tested. The three-sensor FPGA bench is a separate measured path. Research observer RTL has found additional digital events, but their cause and localization accuracy remain unverified.

Explore the design flow

The product brief

Multi-node ultrasound sensing, a USB data interface and a 3D viewer are the shared product requirements.

  • Capture ultrasound echoes
  • Define sensor geometry
  • Show the scene in 3D

01ELECTRONICS

Schematic → PCB

Nine sensor interfaces, power and a direct FPGA connection become a native carrier PCB design.

Native top-side 3D export of the EchoMind Cross9 R3 carrier PCB, showing nine sensor connectors, mounted components and the 64 by 43 millimeter outline.
Cross9 R3 · native PCB top view

02MECHANICAL

Sensor geometry → CAD

The native board outline and nine acoustic openings inform a compact enclosure CAD assembly.

Source-derived Cross9 R3 closed enclosure CAD with nine acoustic openings; physical fit and fabrication remain unverified.
Cross9 R3 · source-derived closed enclosure CAD

03FIRMWARE & SOFTWARE

FPGA RTL → host viewer

Four independent sensor buses, pulse/IRQ timestamps and signed I/Q transport feed the host viewer. Three physical nodes have run at 400 kHz; passive edge-observer RTL now helps investigate timing anomalies.

USSAIR10000 engineering flow from sensor inputs through four-bus FPGA RTL, signed I/Q capture and host display; three physical nodes measured at 400 kilohertz, while localization accuracy remains unverified.
RTL and host flow · physical capture demonstrated; localization accuracy unverified

INTEGRATION TARGET

Electronics + mechanics + code

Shared geometry, board interfaces and data formats let each design track connect to the same product brief.

Reviewable design package
Editable design filesManufacturing packageSource & test package

Cross9 R3 is a reviewed CAD and PCB design assembly; physical first fit and full nine-node function remain to be tested. The three-sensor FPGA bench is a separate measured path. Research observer RTL has found additional digital events, but their cause and localization accuracy remain unverified.

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